The compact nSpec® system is used in the United States, Europe, and Asia to inspect wafers at every step of the production process from bare wafers through post dicing and post packaging. The nSpec® software can assess wafer surface quality and count and bin defects at a fraction of the cost of large inspection devices.
The nSpec® optical inspection system employs super resolution, machine learning, and artificial intelligence analyzers that allow the user to customize feature and defect reporting. The system can be used to inspect bare, substrate, epi, patterned, and etched wafers, as well as chips and MEMs.
The user can easily configure the nSpec® to inspect wafers at any of stage production processes. The nSpec® software can connect with all the inspection devices in a fab so engineers can find correlations between defect-identification data and process-tool parameters and make timely corrections to fabrication tools.
The system can be integrated with standard software. SECS/GEM, Klarity (KLARF import/export), proprietary process control, and LIMS systems compatible.