With features that automate the inspection process
A device inspection process that compares the image of a die without defects to other dies on the wafer and reports the position coordinates of all dies with defects whether they are random defects caused by particles, or systematic defect clusters caused by conditions of the photomask and exposure process. The system then generates a defect map report of all defects detected on the wafer.
An AI Analyzer that “learns” which defects to detect and label. The system can be trained to detect defects with as few as 10 samples, the average is 30. Once trained, you can import the algorithm into a production tool and begin automatically classifying defects. The AI analyzer can detect and classify defects on bare substrate, epi wafers, thin films, glass, and any other material with a uniform background.