nSpec® PS

nSpec® PS

A fully automated optical inspection system for analyzing opaque, transparent, and semi-transparent wafers for defects and features of interest.

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Automated Inspection with Human-Level Intelligence

Sequencing is easy to save in a recipe to assist in generating highly repeatable studies. The user can mark wafers as rejects to assist in the quality control process. Nanotronics' loader control software features group and individual wafer handling. Control software keeps wafers safe by properly reporting and handling all motion control errors.

nSpec® PS

Fully Automated Inspection for:

  • Substrate Wafers
  • Epi Wafers
  • Patterned Wafers
  • Diced Wafers
  • Individual Devices
nSpec® PS

Features

Automated Wafer Handling Multiple Resolution Settings Ranging from 0.25 μm and greater Rapid Scanning Customizable Defect Reports Variety of Sample Chucks to Meet Specific Needs Robust Analysis for Defect or Feature of Interest Detection and Classification Inspection and Review Procedures Multi-System Synchronization Small Footprint and Minimal Facilities Requirements Rack-Mount Controls

Intelligent features that automate your inspection

An artificial intelligence analyzer trained with sparse data to recognize defects and features of interest. Once trained, the analyzer can be imported into a production tool and begin to automatically detect and classify defects.

This automation creates highly repeatable inspection results and reduces the chance of operator error.

A device inspection feature that compares a die without defects to other dies and reports the position coordinates of all dies with defects, whether they are random defects caused by particles or systematic defect clusters caused by conditions of the photomask and exposure process.  The system then generates a defect map report of all defects detected on the wafer.

nSpec® PS

Specifications

  • Weight

    318 kg

  • Dimensions (W x D x H)

    153 cm x 133 cm x 176 cm

  • Min. Vacuum Requirement

    24 in. Hg (70 kPa)

  • Power Supply

    110v/220v, 3.5 amps

  • Runs One Cassette at a Time

    25 wafers/cassette, Standard H-Bar Cassette

  • Standard Wafer Sizes

    50, 75, 100, 150, or 200 mm

  • Dimensions (W x D x H):

    71 cm x 75 cm x 35 cm

  • Weight

    54 kg

  • Pre-aligner

  • Illumination Modes

    Brightfield, Darkfield, DIC (Nomarski)

  • Lightsource

    White Light LED (other options available)

  • Objectives

    2.5, 5, 10, 20, or 50x, user selectable

  • Travel, Typical

    200 mm X and Y direction

  • Positioning

    Linear servo motors with closed loop encoders (50 nm resolution)

  • Repeatability

    +/- 0.5 μm

  • Travel Flatness

    30 μm

  • Construction

    Precision ground raceways and crossed roller bearings

  • Mounting Platform

    Microscope/heavy duty pedestal integrated into isolation table

  • Centered Load Capacity

    2.27 kg

  • Weight

    11.33 kg

  • Size (W x D x H)

    35 cm x 37 cm x 4 cm

  • AFM

  • SECS/GEM

  • OCR Camera

  • Transmitted Light