nSpec® PS

nSpec® PS

A fully automated, optical inspection system for analyzing opaque, transparent, and semi-transparent wafers for defects.

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Automated Inspection with Human-Level Intelligence

Nanotronics Automation’s loader control software features group and individual wafer handling. The software can save sequencing in a recipe to assist in generating highly repeatable studies. The software also allows the user to mark wafers as rejects to assist in the quality control process. The control software keeps wafers safe by properly reporting and handling all motion control errors.

nSpec® PS

Fully Automated Inspection for:

  • Substrate Wafers
  • Epi Wafers
  • Patterned Wafers
  • Diced Wafers
  • Individual Devices
nSpec® PS

Features

Multiple magnification settings Rapid scanning Wafer mosaicing Customizable defect reports Settings for single image capture and scans Configuration options for wafer size, defect type, and scan resolution Sample chuck sizes to meet specific needs Automatic wafer loader

Intelligent features that automate your inspection

An artificial intelligence analyzer you train, with as few as 10 samples, to recognize your defects of interest. Once trained, you can import the analyzer into a production tool and begin to automatically detect and classify defects.

Using the AI analyzer eliminates the need for image tagging and other tasks that you have been doing manually. This automation speeds up inspection and eliminates operator error.

The AI analyzer uses a deep learning convolutional neural network to breakdown images into a matrix of pixels and then it stores that information for future comparison to other images.  Over time, the algorithm “learns”.  It gets better and faster until the detection and classification is fully and reliably automated.

A device inspection feature that compares a die without defects to other dies and reports the position coordinates of all dies with defects, whether they are random defects caused by particles, or systematic defect clusters caused by conditions of the photomask and exposure process.  The system then generates a defect map report of all defects detected on the wafer.

nSpec® PS

Specifications

  • Travel, Typical:

    200 mm X and Y direction

  • Precision Lead Screws:

    2 mm pitch, preloaded ball screws

  • Centered Load Capability:

    2.27 kg

  • Repeatability:

    +/- 5 μm

  • Construction:

    a) Precision ground alum plates b) Stainless steel raceways

  • Step Size:

    0.04 μm

  • Travel Flatness:

    30 μm

  • Weight:

    5.44 kg

  • Limit Switches:

    Mechanical, non-adjustable

  • Wafer Vacuum Chuck (optional):

    Adjustable to 50, 75, 100, 150, or 200 mm

  • White Illumination:

    LED (other options available)

  • Brightfield/Darkfield Objectives:

    5, 10, 20, or 50x, user selectable

  • Differential Interference Contrast:

    (Normarski)

  • Pixel Size, Typical:

    5.5 μm

  • Image Size, Typical:

    6 MP or greater

  • Maximum Frame Rate:

    17.4 fps

  • Type:

    Monochrome standard (color available on request)

  • Standard Wafer Sizes:

    50, 75, 100, 150, or 200 mm

  • Dimension (width x length):

    36 cm x 75 cm

  • Weight:

    34 kg

  • Minimum Vacuum Requirement:

    20 in. Hg

  • Power Supply:

    110v/220v

  • Stage, Focus, Nosepiece, Illumination, Camera:

    Fully automated control for all system components. System allows for manual user operation.

Available Software Configurations

PioneerSystem
Designed for the inspection of unpatterned wafers, film, and glass.

Fremont + Macro

Wallabout System
Designed to inspect patterned wafers, chips and MEMS.

Pinnacles System
Combines the bare wafer inspection capabilities of the Pioneer System with AI defect detection and the device inspection feature recognition of the Wallabout System for a comprehensive inspection tool.