nSpec PRISM™

nSpec PRISM™
The platform introduces a new illuminator which allows Nanotronics to deliver more power to the sample plane. The illuminator enables operators to utilize existing imaging modalities like brightfield, transmission, darkfield, and Nomarski DIC while adding UV and IR illumination to inspection processes.
Learn MoreA Complete SiC Manufacturing Solution
nSpec PRISM™ offers a complete solution for SiC frontend wafer manufacturing from unpolished SiC substrate to epitaxy and device manufacturing, eliminating the need for destructive testing methods such as KOH etching. The system specializes in pairing transmission and PL microscopy for high volume inspection of SiC killer defects such as micropipes and dislocations.
nSpec PRISM™
AI infrastructure
- The nSpec PRISM™ system, when coupled with Nanotronics’ existing AI infrastructure, nTelligence™, allows customers to detect and classify stacking faults, triangles, and other defects of interest on SiC epitaxial wafers as well as cracks and sliplines in GaN.
nSpec PRISM™
Specifications
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Linear Drive, X/Y travel
200 x 200 mm
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Repeatability
± 2 μm (micrometers)
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Resolution
0.2 μm
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Stage flatness
Better than 30 micrometers
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Center load capacity
2.3 kg (5 lbs)
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Wafer chuck
50/75/100/150/200 mm vacuum chuck
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Limit switches
Fixed, optical
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Illuminator
Vertical, episcopic illumination
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Nosepiece
Linear, 5-position
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Illumination
LED, UV (reflected) LED, white (reflected or transmitted)
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Illumination modes
Brightfield; Darkfield; DIC; Photoluminescence
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Objectives
1.25x, 2x, 2.5x, 4x, 5x, 10x, 20x, 50x
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Filter slider
6-position user-selectable
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Cassette
Single cassette; 50, 75, 100, 150, and 200 mm wafers
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Cassette size
Automatically detected
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Cassette type
Standard H-bar
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End effector
Single arm, standard center contact
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Wafer alignment
Automatic alignment by notch or flat
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OCR: top-mount (2-8"); bottom-mount (3-8"), or both
Supported fonts: 2D, T7; 2D, Data Matrix; 2D, QR Code; BC, BC412; BC, IBM 412; SEMI M1.15; Chars, SEMI; Chars, IBM; Chars, Triple; Chars, OCR-A; and Chars, Chartered
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Imaging mode
Monochrome
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Pixel size
≤ 5 μm
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Image size
≥ 6 MP (mega-pixels)
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Frame rate
> 50 fps
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Lighting tower
Red (error); Green (idle); Yellow (scanning)
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Environment vibration requirements
nSpec® must be contained in an environment that meets or exceeds the vibrational limits as specified by ISO 2631-1-C.3
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Focus
Automatic predictive or by focus on each tile
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Stage
Automatic; manual (joystick or computer)
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Nosepiece
Automatic; objective selectable by job
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Illumination
Automatic; intensity selectable by job
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Camera settings
Selectable by job
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Automatic scan
100% wafer scan; user defined pattern; device scan
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Automatic analysis
Standard analysis for bare wafer scan and device inspection; AI analysis
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Defect map
Defect count report; defect size report; defect class report (configurable binning)
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Export
Bare wafer scan: csv; device wafer scan: csv; xml; klarf
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SECS/GEM
Reference: SECS/GEM Interface Reference Manual for the nSPEC®, nCONTROL® and nSCAN®
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Voltage
120/208 V; 30/15 amp
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Vacuum
-21 in. Hg (-70 kPa), minimum
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Width, Depth, Height
92.92 x 61.78 x 76.25 in
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Weight
363 kg/800 lb