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nSpec PRISM™

overview features specs

nSpec PRISM™

The platform introduces a new illuminator which allows Nanotronics to deliver more power to the sample plane. The illuminator enables operators to utilize existing imaging modalities like brightfield, transmission, darkfield, and Nomarski DIC while adding UV and IR illumination to inspection processes.

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A Complete SiC Manufacturing Solution

nSpec PRISM™ offers a complete solution for SiC frontend wafer manufacturing from unpolished SiC substrate to epitaxy and device manufacturing, eliminating the need for destructive testing methods such as KOH etching. The system specializes in pairing transmission and PL microscopy for high volume inspection of SiC killer defects such as micropipes and dislocations.

nSpec PRISM™

AI infrastructure

  • The nSpec PRISM™ system, when coupled with Nanotronics’ existing AI infrastructure, nTelligence™, allows customers to detect and classify stacking faults, triangles, and other defects of interest on SiC epitaxial wafers as well as cracks and sliplines in GaN.

nSpec PRISM™

Specifications

  • Linear Drive, X/Y travel

    200 x 200 mm

  • Repeatability

    ± 2 μm (micrometers)

  • Resolution

    0.2 μm

  • Stage flatness

    Better than 30 micrometers

  • Center load capacity

    2.3 kg (5 lbs)

  • Wafer chuck

    50/75/100/150/200 mm vacuum chuck

  • Limit switches

    Fixed, optical

  • Illuminator

    Vertical, episcopic illumination

  • Nosepiece

    Linear, 5-position

  • Illumination

    LED, UV (reflected) LED, white (reflected or transmitted)

  • Illumination modes

    Brightfield; Darkfield; DIC; Photoluminescence

  • Objectives

    1.25x, 2x, 2.5x, 4x, 5x, 10x, 20x, 50x

  • Filter slider

    6-position user-selectable

  • Cassette

    Single cassette; 50, 75, 100, 150, and 200 mm wafers

  • Cassette size

    Automatically detected

  • Cassette type

    Standard H-bar

  • End effector

    Single arm, standard center contact

  • Wafer alignment

    Automatic alignment by notch or flat

  • OCR: top-mount (2-8"); bottom-mount (3-8"), or both

    Supported fonts: 2D, T7; 2D, Data Matrix; 2D, QR Code; BC, BC412; BC, IBM 412; SEMI M1.15; Chars, SEMI; Chars, IBM; Chars, Triple; Chars, OCR-A; and Chars, Chartered

  • Imaging mode

    Monochrome

  • Pixel size

    ≤ 5 μm

  • Image size

    ≥ 6 MP (mega-pixels)

  • Frame rate

    > 50 fps

  • Lighting tower

    Red (error); Green (idle); Yellow (scanning)

  • Environment vibration requirements

    nSpec® must be contained in an environment that meets or exceeds the vibrational limits as specified by ISO 2631-1-C.3

  • Focus

    Automatic predictive or by focus on each tile

  • Stage

    Automatic; manual (joystick or computer)

  • Nosepiece

    Automatic; objective selectable by job

  • Illumination

    Automatic; intensity selectable by job

  • Camera settings

    Selectable by job

  • Automatic scan

    100% wafer scan; user defined pattern; device scan

  • Automatic analysis

    Standard analysis for bare wafer scan and device inspection; AI analysis

  • Defect map

    Defect count report; defect size report; defect class report (configurable binning)

  • Export

    Bare wafer scan: csv; device wafer scan: csv; xml; klarf

  • SECS/GEM

    Reference: SECS/GEM Interface Reference Manual for the nSPEC®, nCONTROL® and nSCAN®

  • Voltage

    120/208 V; 30/15 amp

  • Vacuum

    -21 in. Hg (-70 kPa), minimum

  • Width, Depth, Height

    92.92 x 61.78 x 76.25 in

  • Weight

    363 kg/800 lb