nSpec® PS

nSpec® PS

A fully automated optical inspection system for analyzing opaque, transparent, and semi-transparent wafers for defects and features of interest.

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Automated Inspection with Human-Level Intelligence

Sequencing is easy to save in a recipe to assist in generating highly repeatable studies. The user can mark wafers as rejects to assist in the quality control process. Nanotronics' loader control software features group and individual wafer handling. Control software keeps wafers safe by properly reporting and handling all motion control errors.

nSpec® PS

Fully Automated Inspection for:

  • Substrate Wafers
  • Epi Wafers
  • Patterned Wafers
  • Diced Wafers
  • Individual Devices
nSpec® PS


Automated Wafer Loader: Cassette or FOUP Brightfield, Darkfield, and DIC (Nomarski prism) Illumination Modes Multiple Resolution Options Customizable Job Creation Image Analysis to Detect, Classify, Quantify Defects or Features of Interest Multi-System Synchronization SECS/GEM and MES Compatible

Intelligent features that automate your inspection

An artificial intelligence analyzer trained with sparse data to recognize defects and features of interest. Once trained, the analyzer can be imported into a production tool and begin to automatically detect and classify defects.

This automation creates highly repeatable inspection results and reduces the chance of operator error.

A device inspection feature that compares a die without defects to other dies and reports the position coordinates of all dies with defects, whether they are random defects caused by particles or systematic defect clusters caused by conditions of the photomask and exposure process.  The system then generates a defect map report of all defects detected on the wafer.

nSpec® PS


  • Travel, Typical:

    200 mm X and Y direction

  • Precision Lead Screws:

    2 mm pitch, preloaded ball screws

  • Centered Load Capability:

    2.27 kg

  • Repeatability:

    +/- 0.5 μm

  • Construction:

    a) Precision ground alum plates b) Stainless steel raceways

  • Step Size:

    0.04 μm

  • Travel Flatness:

    30 μm

  • Weight:

    5.44 kg

  • Limit Switches:

    Mechanical, non-adjustable

  • Wafer Vacuum Chuck (optional):

    Adjustable to 50, 75, 100, 150, or 200 mm

  • White Illumination:

    LED (other options available)

  • Brightfield/Darkfield Objectives:

    5, 10, 20, or 50x, user selectable

  • Differential Interference Contrast:


  • Standard Wafer Sizes:

    50, 75, 100, 150, or 200 mm

  • Dimension (width x length):

    36 cm x 75 cm

  • Weight:

    34 kg

  • Minimum Vacuum Requirement:

    20 in. Hg

  • Power Supply:


  • Stage, Focus, Nosepiece, Illumination, Camera:

    Fully automated control for all system components. System allows for manual user operation.